polishing machine HIT-610AT
polishing machine HIT-610AT summary
HIT-610AT is full auto(C to C) polishing machine for glass wafer.
HIT-610AT use granite on polishing table, so this table doesn't change surfice level according to frictional heat.
polishing machine HIT-610AT specification
Model No. | HIT-610AT |
---|---|
Plate size | Ø610mm,Granite |
Plate rotation speed | 0-100rpm |
shaft for process | 1shaft Vacuum clamping |
Press type | Air sylinder |
Maximum Pressure | 0-100kg |
Process head rotation speed | 1-100rpm |
Force drive shaft | 1shaft |
Object size | Maximum Ø200mm |
Planetary motion stroke | +/-50mm |
Planetary motion speed | 1-30mm/sec |
Operation panel | LCD touch panel |
Control type | Sequence control |
Dimension | W2665xD1210xH1850mm |
Machine weight | 2500kg |
Notes | Wet in Wet out type CtoC |
*Specifications are subject to change without prior notice
Additional parts for polishing machine HIT-610AT
- static spindle
- Airbag pressure mechanism