Lap,Polish,Other products and consumables
Hitechnoth develop Lapping machine and facing machine for compound wafer process.
- Lapping machine HIT-12B,table size small lapping machine
- Lapping machine HIT-15FODC,facing mechanism and planetary motion mechanism
- Lapping machine HIT-18FODC,facing and planetary motion mechanism
- Lapping machine HIT-24FDW,facing and High pressure correspondence mechanism
- Lapping machine HIT-24FOD-R3, automatic facing mechanism
- Facing machine HIT-48F,semi auto facing machine
Hitechnoth develop Polish machines for compound wafer process.
- Polish machines HIT-18POAb-H2,high pressure correspondence,rust proof
- Polish machines HIT-24PS,airbag high pressure mechanism,rust proof
- Polish machines HIT-24P-H4,static spindle 4asxis and high pressure
- Polish machines HIT-610AT,full auto(C to C) polishing machine for glass wafer
Hitechnoth propose you suitable products for compound wafer lapp, polish.
- Mounter HIT-MS250P,Table size Wafer mounter
- Mounter HMS-400P,Wafer mounter with high pressure
- Demounter HIT-DMS,compound Wafer demounter
- Slurry discharging unit NDR-07-TB,bubble mixing slurry discharger
- Chiller HIT-1W-H3-5,water cooled chiller
Hitechnoth propose you suitable consumables for compound wafer lapp, polish.
- Plates and carrier
- Conditioning carrier
- Condithioning ring
- Polishing pad
- Powder and Slurry
Hitechnoth deals used lapping machine,polishing machines, and various equipments.