Demounter HIT-DMS summary
HIT-DMS is demounter to demount under 100um wafer from support substrate.
And demounting process is as follows,
- Demount thin wafer from suppor substrate, and bring out one by one.
- By sequence control,this machine check demounting point and temperature.
so HIT-DMS achieve automatic demounting.
Demounter HIT-DMS specification
|Support substrate size||under Ø200mm wafer|
|Plate temperature setting||MAX200℃|
|bject wafer material||GaAS,Sapphire,SiC, etc|
|Mounting/demounting||Vacuum clamp slide|
|Pressure type||Vacuum pump|
|Operation panel||LCD touch panel|
|Operation type||equence control|
*Specifications are subject to change without prior notice
*To use this HIT-DMS, you need air supply.
Additional parts for Demounter HIT-DMS